MECHANIC XGSP50 183 Tin Solder Flux Paste For PCB SMD BGA Chip Repair

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XGSP50 XG-50 MECHANIC Solder Flux Paste Soldering Tin Cream Sn63/Pb37 For PCB SMD BGA Chip Repair

use liquid flux if it is dry CONDITION
This is one of the best inventions for home electronics builders
Alloy: Sn63 / Pb37 | Microns: 25-45um
Low melting – point. You may just dilute with liquid flux to make it flow better.
It can also be used with small syringe to apply the solder to the PCB.

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