Mechanic XG50 XGSP50 Sn63/Pb37 Solder Tin Paste Melting Point 183℃ Soldering Flux Paste for Phone PCB Board SMD Chips Repair

Mechanic XG50 XGSP50 Sn63/Pb37 Solder Tin Paste Melting Point 183℃ Soldering Flux Paste for Phone PCB Board SMD Chips Repair

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iProGadgets Repair Tools Mechanic XG50 XGSP50 Sn63/Pb37 Solder Tin Paste Melting Point 183℃ Soldering Flux Paste for Phone PCB Board SMD Chips Repair


Specifications:
Brand: MECHANIC
Model: XG50 / XGSP50
Melting Point: 183℃

Precautions:
Keep away from children.
Avoid contacting with eyes.
Use only with adequate ventilation.
The solder paste contains organic solvent. Avoid repeated contact with skin. If the solder paste gets on your skin, wipe it off with alcohol and rinse thoroughly with water.
In order to be cautious, in the operation, the smoke released by the solvent during operation should be avoided as much as possible, and the skin and mucous membrane tissues should not be contacted for too long. Avoid repeated breathing of vapor.

Warning:
The weight mentioned in the picture and description is the gross weight.
Light shooting and different displays may cause the color of the item in the picture a little different from the real thing.

Package Included:
1* Mechanic Solder Tin Paste (Model as your choice.)
 

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