I2C T18 PCB Pre-heating Station for iPhone X-15Pro Max Android CPU Chip Degumming Motherboard Layered Desoldering Platform
iProGadgets Repair Tools I2C T18 PCB Pre-heating Station for iPhone X-15Pro Max Android CPU Chip Degumming Motherboard Layered Desoldering Platform
Features:
T18 PCB motherboard desoldering station, magnetic modular design, constant temperature desoldering, and explosion-tin proof
LCD HD screen display, 2Gears of temp adjustment, Supports iPhone X to 15Pro Max motherboard separation, chip CPU glue removal, and other functions
Aviation aluminum material, CNC precision processing, high-temperature resistance, and oxidation resistance
Rapid heating, matched with PTC ceramic heating pieces, it can heat up to 180C in 60 seconds rapidly
Module strong magnetic automatic adsorption, module replacement as you wish, simple and more convenient
Put the chip on and switch to 245℃, then use a brush to remove the glue and tin residue on the chip, it can be adapted to 98%of the chips and can meet the needs of 98%of IC glue removal and desoldering on the market.
Only one host can support multiple modules, support Apple and Android double-layer motherboard layering, fit, and repair, and can also be applied to the repair of various precision electronic and digital products
Specification:
Model: T18
Name: T18 PCB motherboard desoldering station
Supply Voltage: AC 110V~220V
Minimum temperature: 180°C
Display: LED digital display
Maximum temperature: 245℃
Body size: 134*116*17mm
Scope of use: Motherboard separation and bonding
Packing size: 214*143*80mm
