Amaoe 0.15mm Qualcomm QCN6274 WiFi7 Wireless Module IC Chip BGA Reballing Stencil

Amaoe 0.15mm Qualcomm QCN6274 WiFi7 Wireless Module IC Chip BGA Reballing Stencil

  • $3.50
    Unit price per 
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iProGadgets Repair Tools Amaoe 0.15mm Qualcomm QCN6274 WiFi7 Wireless Module IC Chip BGA Reballing Stencil

Package includes:
  • 1 x Stencil

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