MaAnt SL-2 CPU Heating Platform Magical Degumming Station For Mobile Phone IC CPU Heating Glue Removal
iProGadgets Repair Tools MaAnt SL-2 CPU Heating Platform Magical Degumming Station For Mobile Phone IC CPU Heating Glue Removal Solder Removal BGA Reball
Descriptions:
Compatible with chips smaller than 20mm x 18.5mm, suitable for more than 99% of chips on the market.
Suitable for removing glue and tin from multiple generations of iPhone and Android phone chips.
One-button heating, rapid heating, adjustable temperature range of 160-250°C.
Residual solder can be easily cleaned using a cotton swab without a solder wick.
The temperature is 100 degrees lower than that of a hot air gun, making glue or tin removal safer.
No need for repeated scraping with a soldering iron, and avoid damaging the solder pads.
Low voltage heating plate, non-traditional high-voltage heating, no leakage of electric static.
Built-in professional training curve, no need to worry about thermal stress causing chip damage.
Full bonding design, no need to worry about chip deformation or damage due to the chip's bottom lifting.
Descriptions:
Compatible with chips smaller than 20mm x 18.5mm, suitable for more than 99% of chips on the market.
Suitable for removing glue and tin from multiple generations of iPhone and Android phone chips.
One-button heating, rapid heating, adjustable temperature range of 160-250°C.
Residual solder can be easily cleaned using a cotton swab without a solder wick.
The temperature is 100 degrees lower than that of a hot air gun, making glue or tin removal safer.
No need for repeated scraping with a soldering iron, and avoid damaging the solder pads.
Low voltage heating plate, non-traditional high-voltage heating, no leakage of electric static.
Built-in professional training curve, no need to worry about thermal stress causing chip damage.
Full bonding design, no need to worry about chip deformation or damage due to the chip's bottom lifting.
