Amaoe 0.15mm Qualcomm QCN6274 WiFi7 Wireless Module IC Chip BGA Reballing Stencil

Amaoe 0.15mm Qualcomm QCN6274 WiFi7 Wireless Module IC Chip BGA Reballing Stencil

  • $3.50
    Einzelpreis pro 


iProGadgets Repair Tools Amaoe 0.15mm Qualcomm QCN6274 WiFi7 Wireless Module IC Chip BGA Reballing Stencil

Package includes:
  • 1 x Stencil

Wir empfehlen außerdem