YCS-H03 Mini Fixture Mobile Phone Motherboard Chip BGA Clamp Multi-function Glue Removal BGA Soldering Adjustable PCB Clamp
iProGadgets Repair Tools YCS-H03 Mini Fixture Mobile Phone Motherboard Chip BGA Clamp Multi-function Glue Removal BGA Soldering Adjustable PCB Clamp
Features:
1 x Fixture
Features:
- Larger size, more clamping space, fully applicable to various types of chips/motherboards
- Removal of tin and glue, no need to adjust the direction, travel coaxial movement
- For iPhone / Android full series IC chip, removal of glue/tin Not blocking the knife
- Motherboard cleaning doesn't require adjusting the orientation, clean up at once
- The module is suitable for various sizes of motherboards in all aspects
1 x Fixture
