MECHANIC XGSP50 183 Tin Solder Flux Paste For PCB SMD BGA Chip Repair

Frais de port calculés à l'étape de paiement.

XGSP50 XG-50 MECHANIC Solder Flux Paste Soldering Tin Cream Sn63/Pb37 For PCB SMD BGA Chip Repair

use liquid flux if it is dry CONDITION
This is one of the best inventions for home electronics builders
Alloy: Sn63 / Pb37 | Microns: 25-45um
Low melting – point. You may just dilute with liquid flux to make it flow better.
It can also be used with small syringe to apply the solder to the PCB.

Nous vous recommandons également

JCID V1S JC V1SE MV01 Screen Testing FPC Flex Cable for iphone Smartphone LCD screen Function Testing Cable

JC Aixun iHeater Pro Intelligent Desoldering Station for iPhone X XS MAX 11 12 13 14 15 16 Pro Max Plus Android Frame Separate

JC Intelligent Drawing Current Analyzer One-Key Booter Real-time Voltage Power Curves Display Quickly Locate Failure Points

BAKU BA-898A+ 2-In-1 Soldering Station Hot Air Station Adjustable Temperature US Plug 110V

Replacement AMOLED Display For Xiaomi Mi 11 Ultra 5G M2102K1G M2102K1C Touch Screen Digitizer Assembly