Amaoe BGA153 BGA169 BGA162 BGA254 BGA221 BGA186 Reballing Stencil for EMMC CPU IC Chip Tin Planting Soldering Net 0.15MM

Frais de port calculés à l'étape de paiement.

Quantité

AMAOE 0.15MM EMMC EMCP UFS BGA153 BGA162 BGA169 BGA254 BGA Reballing Stencil Kits Platform With Plate And Holder

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