Amaoe 0.15mm Qualcomm QCN6274 WiFi7 Wireless Module IC Chip BGA Reballing Stencil

Frais de port calculés à l'étape de paiement.

iProGadgets Repair Tools Amaoe 0.15mm Qualcomm QCN6274 WiFi7 Wireless Module IC Chip BGA Reballing Stencil

Package includes:

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