Amaoe 0.12mm Lower Layer (CPU) BGA Reballing Stencil Platform Set for Apple A18 Pro / iPhone 16P / 16PM

Amaoe 0.12mm Lower Layer (CPU) BGA Reballing Stencil Platform Set for Apple A18 Pro / iPhone 16P / 16PM

  • $2.70
    Prix unitaire par 
Frais de port calculés à l'étape de paiement.


iProGadgets Repair Tools Amaoe 0.12mm Lower Layer (CPU) BGA Reballing Stencil Platform Set for Apple A18 Pro / iPhone 16P / 16PM

Package includes:
  • 2 x Tin Scraping Blade
  • 1 x Positioning Plate
  • 1 x Magnetic Base
  • 1 x Stencil

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