Wylie WL-736L Universal Magnetic Stage for Mobile Phone Mid-Level Motherboard Soldering

$13.00
Precio unitario por

Los gastos de envío se calculan en la pantalla de pagos.

iProGadgets Repair Tools Wylie WL-736L Universal Magnetic Stage for Mobile Phone Mid-Level Motherboard Soldering

Description:
WYLIE WL-736L Universal Magnetic Platform 3D Silicon Mat
Universal Magnetic Base Resistant High-Temperature Repair Base
for Mobile Phone Middle Frame BGA Reballing CPU IC Chip Rework

También recomendamos

Amaoe S24 Reverse Middle Layer Planting Tin Platform Set Suit for Samsung SM-S921U Motherboard Middle Layer Steel Mesh Template

Amaoe Strong Magnetic Planting Tin Platform Set for SAMSUNG S22 Ultra SM-S908U/W/O/D/E SM-S908B/BE Middle Layer Solder Tin Net

Amaoe S23+ Reverse Side Middle Frame BGA Reballing Stencil Platfrom for Samsung Galaxy S916U/S911 Motherboard Repair Fixture

Amaoe Middle Layer Planting Tin Platform Set for Samsung S23Ultra SM-918U Strong Magnetic 0.12mm BGA Reballing Stencil Kit

Amaoe Middle Layer Reballing Stencil Template for Samsung S21 SM-G991U/0/W/D-S Positioning Solder Planting Tin Net