Relife RL-044 0.12mm Middle Layer BGA Reballing Stencil for iPhone 16 / 16 Plus / 16 Pro / 16 Pro Max

$2.30
Precio unitario por

Los gastos de envío se calculan en la pantalla de pagos.

Cantidad

iProGadgets Repair Tools Relife RL-044 0.12mm Middle Layer BGA Reballing Stencil for iPhone 16 / 16 Plus / 16 Pro / 16 Pro Max

Package includes:
1 x Stencil

Notice:
Remove the heat dissipation sticker on the bottom of the motherboard then plant the tin, please remove the steel stencil before heating!!!

También recomendamos

Replacement Camera Sponge Rubber For Android Mobile Phone Front Rear Camera Anti Dust Foam 100PCS

Refox 5 In 1 FM-40 LCD Glass Lamination Machine Heating Separator Screen Refurbishing

Aweshine TS-01 SIM Card Tester Universal Sim Card Signal Holder Quickly Test SIM Card Faults Resistance Collection Analyzer

AMAOE AMD Graphics Card 216-0857037 Planting Tin Steel Mesh Template 0.25mm Directly Heating BGA Reballing Stencil

Amaoe Planting Tin Steel Mesh Template for DLPC3435CZEZ BGA201 0.12mm Strong Magnetic BGA Reballing Stencil Solder Tin Net