Qianli BGA Reballing Stencil for EMMC EMCP BGA162 BGA254 BGA186 BGA153 BGA169 BGA221 Soldering Template Thickness 0.12mm
Qianli BGA Reballing Stencil for EMMC EMCP BGA162 BGA254 BGA186 BGA153 BGA169 BGA221 Soldering Template Thickness 0.12mm
Description:
--High quality BGA Stencil.
--Specially designed for EMMC/EMCP BGA162 BGA254 BGA186 BGA153 BGA169 BGA221.
--Material : Steel.
--Thickness : 0.12mm.
Memo: This is not an easy job for someone who has no technical skills with Disassembling or Assembling Cellphones/mobile phones, so only purchase this item if you know how to install it. Highly recommend professional installation. We will not be held responsible for any damages to your cellphone/mobile phone that you may cause during the changing of replacement parts.
Before Shipping:
Our QC Will Test the Parts and Assure it is 100% Good Function Before Shipping.
Description:
--High quality BGA Stencil.
--Specially designed for EMMC/EMCP BGA162 BGA254 BGA186 BGA153 BGA169 BGA221.
--Material : Steel.
--Thickness : 0.12mm.
Memo: This is not an easy job for someone who has no technical skills with Disassembling or Assembling Cellphones/mobile phones, so only purchase this item if you know how to install it. Highly recommend professional installation. We will not be held responsible for any damages to your cellphone/mobile phone that you may cause during the changing of replacement parts.
Before Shipping:
Our QC Will Test the Parts and Assure it is 100% Good Function Before Shipping.
